George Tkach
3Patents
3h-index
8Co-inventors
36Inventor score
Filing activity: Mar 14, 2000 → Jan 30, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6673716B1 | Control of the deposition temperature to reduce the via and contact resistance of Ti and TiN deposited using ionized PVD techniques | Electricity | 71 | Expired |
| US6342133B2 | PVD deposition of titanium and titanium nitride layers in the same chamber without use of a collimator or a shutter | Electricity | 51 | Expired |
| US6652718B1 | Use of RF biased ESC to influence the film properties of Ti and TiN | Electricity | 47 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.