Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor

US6030514A · kind A · utility

Assignees

• SONY GROUP CORPORATION · JP
• Lateral Research Limited Liability Company · US

Inventors

• John A. Dunlop · Spokane Valley, US
• Michael Goldstein · Ridgefield, US
• Gerald Feldewerth · Spokane, US
• Cari H. Shim · Sunnyvale, US
• Stephan Schittny · Alzenau, DE

Key dates

• Filing date: May 2, 1997
• Grant date: Feb 29, 2000
• Expiry date: May 2, 2017

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C14/3414
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A target for sputtering is subjected to a surface treatment process and special packaging after target manufacture for improved sputtering performance and process and yield by reducing particulates. The sputtering target is first surface treated to remove oxides, impurities and contaminants. The surface treated target is then covered with a metallic enclosure and, optionally, a passivating barrier layer. The metallic enclosure protects the target surface from direct contact with subsequently employed packaging material such as plastic bags, thereby eliminating sources of organic materials during sputtering operations. The surface treatment of the target removes deformed material, smearing, twins, or burrs and the like from the target surface, reducing "burn-in" or sputter conditioning time prior to production sputtering of thin films.