Patent · US Expired

Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits

US7157381B2 · kind B2 · utility

2Cited by

4References

7Claims

0Family size

Assignees

Infineon Technologies AG · DE
NANYA TECHNOLOGY CORPORATION · TW

Inventors

Dirk Efferenn · Dresden, DE
Jens Hahn · Dresden, DE
Uwe Kahler · Dresden, DE
Chung-Hsin Lin · New Taipei, TW
Jens Bachmann · Langen, DE
Wen-Bin Lin · Dresden, DE
Grit Bonsdorf · Dresden, DE

Key dates

Filing date	Jun 15, 2004
Grant date	Jan 2, 2007
Priority date	—
Expiry date	Jun 15, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76849
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits includes the following steps: providing a substrate; providing a whisker-containing layer made of aluminum metal or an aluminum alloy on the substrate; back-etching and/or resputtering the whisker-containing layer such that the whiskers are essentially removed; and structuring the whisker-free layer into the lines.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.