Gun Lee
10Patents
2h-index
22Co-inventors
54Inventor score
Filing activity: Mar 7, 2003 → May 16, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7148080B2 | Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack package | Electricity | 15 | Expired |
| US10790255B2 | Fan-out semiconductor package | Electricity | 2 | Active |
| US11121079B2 | Fan-out semiconductor package | Electricity | 1 | Active |
| US11837537B2 | Fan-out semiconductor package | Electricity | 0 | Active |
| US11127692B2 | Semiconductor package | Electricity | 0 | Active |
| US10847474B2 | Semiconductor package and electromagnetic interference shielding structure for the same | Electricity | 0 | Active |
| US12341118B2 | Semiconductor package including an encapsulant | Electricity | 0 | Active |
| US12154859B2 | Semiconductor package and method of manufacturing same | Electricity | 0 | Active |
| US12272666B2 | Semiconductor package and method of manufacturing the same | Electricity | 0 | Active |
| US10483150B2 | Apparatus for stacking semiconductor chips in a semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.