Hai-Ming Chen
11Patents
2h-index
16Co-inventors
43Inventor score
Filing activity: Dec 30, 2013 → May 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10157871B1 | Integrated fan-out package and manufacturing method thereof | Electricity | 13 | Active |
| US9691723B2 | Connector formation methods and packaged semiconductor devices | Electricity | 3 | Active |
| US10522436B2 | Planarization of semiconductor packages and structures resulting therefrom | Electricity | 2 | Active |
| US9793242B2 | Packages with die stack including exposed molding underfill | Electricity | 2 | Active |
| US10700031B2 | Integrated fan-out package and manufacturing method thereof | Electricity | 1 | Active |
| US11127644B2 | Planarization of semiconductor packages and structures resulting therefrom | Electricity | 1 | Active |
| US11616037B2 | Integrated fan-out package and manufacturing method thereof | Electricity | 0 | Active |
| US10522486B2 | Connector formation methods and packaged semiconductor devices | Electricity | 0 | Active |
| US11424199B2 | Connector formation methods and packaged semiconductor devices | Electricity | 0 | Active |
| US11355461B2 | Integrated fan-out package and manufacturing method thereof | Electricity | 0 | Active |
| US12412862B2 | Package structure and manufacturing method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.