Integrated circuit package system including honeycomb molding
US8409921B2 · kind B2 · utility
0Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2010 |
| Grant date | Apr 2, 2013 |
| Priority date | — |
| Expiry date | Apr 5, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit package system includes: providing a substrate with a top surface; configuring the top surface to include electrical contacts and an integrated circuit; providing a structure over the substrate with only a honeycomb meshwork of posts contacting the top surface of the substrate; and depositing a material to prevent warpage of the substrate on the top surface of the substrate and over the integrated circuit, the material patterned to have discrete hollow conduits that expose the electrical contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.