Harry Kirk
11Patents
8h-index
9Co-inventors
57Inventor score
Filing activity: Oct 4, 2002 → Dec 1, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7427554B2 | Manufacturing strained silicon substrates using a backing material | Electricity | 33 | Active |
| US7479441B2 | Method and apparatus for flag-less water bonding tool | Electricity | 33 | Active |
| US7094666B2 | Method and system for fabricating strained layers for the manufacture of integrated circuits | Electricity | 28 | Expired |
| US7772088B2 | Method for manufacturing devices on a multi-layered substrate utilizing a stiffening backing substrate | Electricity | 26 | Active |
| US7598153B2 | Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species | Electricity | 23 | Active |
| US7391047B2 | System for forming a strained layer of semiconductor material | Electricity | 14 | Expired |
| US8241996B2 | Substrate stiffness method and resulting devices for layer transfer process | Electricity | 12 | Active |
| US7595499B2 | Method and system for fabricating strained layers for the manufacture of integrated circuits | Electricity | 10 | Active |
| US8187377B2 | Non-contact etch annealing of strained layers | Electricity | 3 | Active |
| US7811901B1 | Method and edge region structure using co-implanted particles for layer transfer processes | Electricity | 1 | Active |
| US7910456B1 | Liquid based substrate method and structure for layer transfer applications | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.