Hazel Schofield
9Patents
6h-index
6Co-inventors
48Inventor score
Filing activity: Mar 28, 2001 → Oct 26, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6624522B2 | Chip scale surface mounted device and process of manufacture | Electricity | 108 | Expired |
| US6767820B2 | Chip scale surface mounted device and process of manufacture | Electricity | 35 | Expired |
| US6890845B2 | Chip scale surface mounted device and process of manufacture | Electricity | 31 | Expired |
| USD503691S1 | Conductive clip for a semiconductor package | General | 26 | Expired |
| US7745930B2 | Semiconductor device packages with substrates for redistributing semiconductor device electrodes | Electricity | 24 | Active |
| US7122887B2 | Chip scale surface mounted device and process of manufacture | Electricity | 8 | Expired |
| US7253090B2 | Chip scale surface mounted device and process of manufacture | Electricity | 4 | Expired |
| US7476979B2 | Chip scale surface mounted device and process of manufacture | Electricity | 3 | Active |
| US7821133B2 | Contact pad structure for flip chip semiconductor die | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.