Semiconductor device packages with substrates for redistributing semiconductor device electrodes
US7745930B2 · kind B2 · utility
24Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2006 |
| Grant date | Jun 29, 2010 |
| Priority date | — |
| Expiry date | Aug 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.