Hisashi Oshima
4Patents
4h-index
4Co-inventors
36Inventor score
Filing activity: Apr 29, 1999 → Jun 26, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6491836B1 | Semiconductor wafer and production method therefor | Electricity | 25 | Expired |
| US6284658A | Manufacturing process for semiconductor wafer | Electricity | 8 | Expired |
| US6220928A | Surface grinding method and apparatus for thin plate work | Performing Operations; Transporting | 5 | Expired |
| US6358117B1 | Processing method for a wafer | Performing Operations; Transporting | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.