Processing method for a wafer
US6358117B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1999 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Nov 17, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A surface grinding method is provided by which grinding striations are produced so that the striations can fully be removed by a polish-off amount less than required in a conventional way in mirror polishing following surface grinding using an infeed type surface grinder, in which two circular tables, opposite to each other, which are driven and rotate independently from each other, are arranged so that the peripheral end portion of one table coincides with an axial center of a rotary shaft of the other table all time, the two circular tables being located so as to be shifted sideways from each other; not only is a grinding stone held fixedly on an opposite surface of the one table, but the wafer is fixed on an opposite surface of the other table; the two tables are rotated relatively to each other; and at least one table is pressed on the other while at least one table is relatively moved in a direction, so that a surface of the wafer is ground, wherein the surface of the wafer is ground while controlling a pitch of grinding striations produced across all the surface of the wafer processed by the grinding stone to be 1.6 mm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.