Inventor

Hung-Jung Tu

30Patents
8h-index
38Co-inventors
71Inventor score

Filing activity: May 24, 2004 → Nov 23, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US8105875B1 Approach for bonding dies onto interposers Electricity 174 Active
US8053277B2 Three-dimensional integrated circuits with protection layers Emerging Cross-Sectional Technologies 19 Active
US7955895B2 Structure and method for stacked wafer fabrication Electricity 19 Active
US7466028B1 Semiconductor contact structure Electricity 15 Active
US8264066B2 Liner formation in 3DIC structures Electricity 12 Active
US8405225B2 Three-dimensional integrated circuits with protection layers Emerging Cross-Sectional Technologies 9 Active
US8759150B2 Approach for bonding dies onto interposers Electricity 9 Active
US8319349B2 Approach for bonding dies onto interposers Electricity 9 Active
US8749027B2 Robust TSV structure Electricity 7 Active
US7812459B2 Three-dimensional integrated circuits with protection layers Emerging Cross-Sectional Technologies 7 Active
US11127650B2 Semiconductor device package including thermal dissipation element and method of manufacturing the same Electricity 3 Active
US9305769B2 Thin wafer handling method Emerging Cross-Sectional Technologies 2 Active
US7943421B2 Component stacking using pre-formed adhesive films Electricity 2 Active
US9390949B2 Wafer debonding and cleaning apparatus and method of use Electricity 1 Active
US10381254B2 Wafer debonding and cleaning apparatus and method Emerging Cross-Sectional Technologies 1 Active
US8148826B2 Three-dimensional integrated circuits with protection layers Emerging Cross-Sectional Technologies 1 Active
US8664749B2 Component stacking using pre-formed adhesive films Electricity 1 Active
US11189604B2 Device assembly structure and method of manufacturing the same Electricity 0 Active
US11264262B2 Wafer debonding and cleaning apparatus Emerging Cross-Sectional Technologies 0 Active
US8629066B2 Liner formation in 3DIC structures Electricity 0 Active
US11373956B2 Semiconductor device package and method of manufacturing the same Electricity 0 Active
US9570331B2 Wafer cassette with electrostatic carrier charging scheme Electricity 0 Active
US7354623B2 Surface modification of a porous organic material through the use of a supercritical fluid Emerging Cross-Sectional Technologies 0 Active
US11631734B2 Vertical capacitor structure having capacitor in cavity, and method for manufacturing the vertical capacitor structure Electricity 0 Active
US11201110B2 Semiconductor device package with conductive pillars and method for manufacturing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.