Device assembly structure and method of manufacturing the same
US11189604B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2019 |
| Grant date | Nov 30, 2021 |
| Priority date | — |
| Expiry date | Oct 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.