Surface modification of a porous organic material through the use of a supercritical fluid
US7354623B2 · kind B2 · utility
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Key dates
| Filing date | May 24, 2004 |
| Grant date | Apr 8, 2008 |
| Priority date | — |
| Expiry date | Aug 10, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249987
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An organic layer, such as a porous low-K dielectric in an IC, contains pores open at its surface. To close the pores, the organic layer is contacted by a supercritical fluid that is a solvent for the layer. After a small amount of the surface and the wall of the open pores is solvated, a phase transition of the solvated organic material is effected at the surface to cover it with a dense, smooth, non-porous film that seals the open pores.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.