Hyunsu Sim
4Patents
1h-index
7Co-inventors
30Inventor score
Filing activity: Jun 23, 2020 → May 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11676914B2 | Semiconductor substrate and method of sawing the same | Electricity | 1 | Active |
| US11854892B2 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Electricity | 0 | Active |
| US12062626B2 | Semiconductor substrate and method of sawing the same | Electricity | 0 | Active |
| US11322405B2 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.