James Chung
3Patents
3h-index
11Co-inventors
47Inventor score
Filing activity: Dec 20, 1995 → Jun 30, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5684332A | Method of packaging a semiconductor device with minimum bonding pad pitch and packaged device therefrom | Electricity | 21 | Expired |
| US7314836B2 | Enhanced nitride layers for metal oxide semiconductors | Electricity | 5 | Expired |
| US7475309B2 | Parallel test mode for multi-core processors | Physics | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.