Jamin Ling
6Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: Jul 28, 1995 → Feb 26, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6445069B1 | Electroless Ni/Pd/Au metallization structure for copper interconnect substrate and method therefor | Electricity | 26 | Expired |
| US6180509A | Method for forming planarized multilevel metallization in an integrated circuit | Electricity | 14 | Expired |
| US6191484A | Method of forming planarized multilevel metallization in an integrated circuit | Electricity | 9 | Expired |
| US7442641B2 | Integrated ball and via package and formation process | Electricity | 3 | Expired |
| US7091469B2 | Packaging for optoelectronic devices | Electricity | 3 | Expired |
| US7637009B2 | Approach for fabricating probe elements for probe card assemblies using a reusable substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.