Packaging for optoelectronic devices
US7091469B2 · kind B2 · utility
3Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2004 |
| Grant date | Aug 15, 2006 |
| Priority date | — |
| Expiry date | May 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
Abstract
An optoelectronic sensor is attached to an optically transparent substrate, such as glass, and encapsulated to form an optoelectronic device. An optical assembly can be mounted opposite the optoelectronic sensor. Filters and refractive index matching materials may be included between the optoelectronic sensor and the optically transparent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.