Jed Davidow
6Patents
6h-index
3Co-inventors
45Inventor score
Filing activity: Apr 7, 1999 → Jan 14, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6455437B1 | Method and apparatus for monitoring the process state of a semiconductor device fabrication process | Electricity | 54 | Expired |
| US6368975B1 | Method and apparatus for monitoring a process by employing principal component analysis | Physics | 43 | Expired |
| US6521080B2 | Method and apparatus for monitoring a process by employing principal component analysis | Physics | 40 | Expired |
| US6413867B1 | Film thickness control using spectral interferometry | Electricity | 40 | Expired |
| US6589869B2 | Film thickness control using spectral interferometry | Electricity | 13 | Expired |
| US6896763B2 | Method and apparatus for monitoring a process by employing principal component analysis | Physics | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.