Jeffrey Toh
4Patents
4h-index
11Co-inventors
43Inventor score
Filing activity: Sep 1, 1998 → Sep 30, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6218202A | Semiconductor device testing and burn-in methodology | Electricity | 58 | Expired |
| US6468831B2 | Method of fabricating thin integrated circuit units | Electricity | 33 | Expired |
| US6274929A | Stacked double sided integrated circuit package | Electricity | 22 | Expired |
| US6617201B2 | U-shape tape for BOC FBGA package to improve moldability | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.