Jia Wen Wang
10Patents
2h-index
17Co-inventors
40Inventor score
Filing activity: Jul 26, 2018 → Nov 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10580788B2 | Methods for forming three-dimensional memory devices | Electricity | 8 | Active |
| US11289422B2 | Bonding alignment marks at bonding in interface | Electricity | 3 | Active |
| US10679854B2 | Wafer bonding method and structure thereof | Electricity | 2 | Active |
| US11049834B2 | Hybrid bonding using dummy bonding contacts | Electricity | 2 | Active |
| US10748851B1 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Electricity | 1 | Active |
| US11205619B2 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Electricity | 1 | Active |
| US11462503B2 | Hybrid bonding using dummy bonding contacts | Electricity | 1 | Active |
| US11342185B2 | Wafer bonding method and structure thereof | Electricity | 0 | Active |
| US11876049B2 | Bonding alignment marks at bonding interface | Electricity | 0 | Active |
| US10833042B2 | Hybrid bonding using dummy bonding contacts | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.