Joeri De Vos
5Patents
3h-index
11Co-inventors
50Inventor score
Filing activity: Jun 1, 2011 → Jul 28, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8530264B2 | Methods for manufacturing arrays for CMOS imagers | Electricity | 14 | Active |
| US8493736B2 | Device for cooling integrated circuits | Electricity | 11 | Active |
| US10170450B2 | Method for bonding and interconnecting integrated circuit devices | Electricity | 3 | Active |
| US11769750B2 | Substrate, assembly and method for wafer-to-wafer hybrid bonding | Electricity | 0 | Active |
| US10066303B2 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.