Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
US10066303B2 · kind B2 · utility
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8References
15Claims
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Key dates
| Filing date | Feb 27, 2015 |
| Grant date | Sep 4, 2018 |
| Priority date | — |
| Expiry date | Feb 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a substrate having at least one main surface comprising at least one non-noble metallic bonding landing pad covered by a capping layer thereby shielding the non-noble metallic bonding landing pad from the environment. This capping layer comprises an alloy, the alloy being NiB or CoB and containing an atomic concentration percentage of boron in the range of 10% to 50%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.