Printed circuit board (PCB) with three-dimensional interconnects to other printed circuit boards
US10617000B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2017 |
| Grant date | Apr 7, 2020 |
| Priority date | — |
| Expiry date | Dec 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for a three-dimensional (“3D”) printed circuit board (“PCB”) to printed circuit board interface is provided. A first PCB includes first landing pads disposed on one or more edges of the first PCB. The first landing pads electrically couple to conductive pins or second landing pads disposed on a second PCB. The second landing pads may be disposed in a slot in the second PCB. The interface between the first landing pads and the second landing pads may provide various advantages over traditional PCB to PCB interfaces, such as, improved signal integrity, improved power integrity, increased contact density, decreased clock jitter, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.