Kai WU
4Patents
1h-index
15Co-inventors
37Inventor score
Filing activity: Dec 9, 2015 → Apr 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9570399B2 | Semiconductor package assembly with through silicon via interconnect | Electricity | 7 | Active |
| US12315746B2 | Bottom cover plate to reduce wafer planar nonuniformity | Electricity | 0 | Active |
| US9947624B2 | Semiconductor package assembly with through silicon via interconnect | Electricity | 0 | Active |
| US11939668B2 | Gas delivery for tungsten-containing layer | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.