Electrically conductive compositions comprising non-eutectic solder alloys
US9005330B2 · kind B2 · utility
5Cited by
39References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2012 |
| Grant date | Apr 14, 2015 |
| Priority date | — |
| Expiry date | Dec 31, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.