Preparation of metallurgic network compositions and methods of use thereof
US8840700B2 · kind B2 · utility
3Cited by
29References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2010 |
| Grant date | Sep 23, 2014 |
| Priority date | — |
| Expiry date | Aug 30, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8384
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.