Land grid array stiffener use with flexible chip carriers
US6528892B2 · kind B2 · utility
60Cited by
18References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2001 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Jun 5, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flexible chip carrier with contact pads on its upper surface matching those of the chip with said pads conductively connected to land grid array (LGA) pads on its lower surface matching the those of a card or PCB. The chip carrier is provided with a stiffening layer at the LGA interface. The stiffening layer is mechanically attached to the lower surface of the chip carrier. Holes are formed in the stiffening layer to expose the LGA pads. The holes are then filled with a conductive adhesive material. Compliant LGA bumps are applied to the uncured conductive adhesive material which material is then cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.