Kuan Ming Kan
3Patents
3h-index
5Co-inventors
39Inventor score
Filing activity: Nov 13, 2000 → Jan 31, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7598600B2 | Stackable power semiconductor package system | Electricity | 8 | Active |
| US7557432B2 | Thermally enhanced power semiconductor package system | Electricity | 4 | Active |
| US6436736B1 | Method for manufacturing a semiconductor package on a leadframe | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.