Stackable power semiconductor package system
US7598600B2 · kind B2 · utility
8Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2006 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Dec 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.