Layal Rouhana
4Patents
2h-index
10Co-inventors
34Inventor score
Filing activity: Jul 30, 2014 → Jan 10, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9496213B2 | Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate | Electricity | 6 | Active |
| US9355898B2 | Package on package (PoP) integrated device comprising a plurality of solder resist layers | Electricity | 2 | Active |
| US10157824B2 | Integrated circuit (IC) package and package substrate comprising stacked vias | Electricity | 1 | Active |
| US10651160B2 | Low profile integrated package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.