Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment
US6639799B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2000 |
| Grant date | Oct 28, 2003 |
| Priority date | — |
| Expiry date | Feb 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.