Ling-Chen Kung
8Patents
8h-index
11Co-inventors
58Inventor score
Filing activity: Sep 18, 1998 → Jun 2, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6277669A | Wafer level packaging method and packages formed | Electricity | 163 | Expired |
| US6197613A | Wafer level packaging method and devices formed | Electricity | 96 | Expired |
| US6268114A | Method for forming fine-pitched solder bumps | Electricity | 67 | Expired |
| US7081404B2 | Methods of selectively bumping integrated circuit substrates and related structures | Electricity | 29 | Expired |
| US6440836B1 | Method for forming solder bumps on flip chips and devices formed | Electricity | 19 | Expired |
| US6179200A | Method for forming solder bumps of improved height and devices formed | Electricity | 18 | Expired |
| US6539624B1 | Method for forming wafer level package | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7579694B2 | Electronic devices including offset conductive bumps | Electricity | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.