Lung-Tien Han
3Patents
2h-index
9Co-inventors
33Inventor score
Filing activity: Sep 28, 2001 → Oct 27, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7524750B2 | Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD | Electricity | 39 | Active |
| US7244658B2 | Low stress STI films and methods | Electricity | 2 | Expired |
| US6524969B2 | High density plasma chemical vapor deposition (HDP-CVD) processing of gallium arsenide wafers | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.