Mark Larsen
5Patents
3h-index
14Co-inventors
54Inventor score
Filing activity: Nov 18, 1991 → Jun 2, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5182880A | Door frame cladding apparatus | Fixed Constructions | 26 | Expired |
| US8058732B2 | Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same | Electricity | 7 | Active |
| US7960800B2 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Electricity | 4 | Active |
| US8072027B2 | 3D channel architecture for semiconductor devices | Electricity | 3 | Active |
| US8598035B2 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.