Matthew Oonk
3Patents
2h-index
13Co-inventors
34Inventor score
Filing activity: Nov 19, 2002 → Jul 6, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6998327B2 | Thin film transfer join process and multilevel thin film module | Electricity | 20 | Expired |
| US8288828B2 | Via contact structure having dual silicide layers | Electricity | 2 | Active |
| US7538029B2 | Method of room temperature growth of SiOx on silicide as an etch stop layer for metal contact open of semiconductor devices | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.