Michael Ianiro
4Patents
2h-index
2Co-inventors
27Inventor score
Filing activity: Oct 2, 2003 → Jun 5, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7112123B2 | Chemical-mechanical polishing (CMP) slurry containing clay and CeO2 abrasive particles and method of planarizing surfaces | Electricity | 14 | Expired |
| US7087529B2 | Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces | Electricity | 4 | Expired |
| US7267784B2 | Chemical-mechanical polishing (CMP) slurry and method of planarizing computer memory disk surfaces | Electricity | 2 | Active |
| US7223156B2 | Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.