Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces
US7087529B2 · kind B2 · utility
4Cited by
10References
10Claims
0Family size
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Key dates
| Filing date | Oct 2, 2003 |
| Grant date | Aug 8, 2006 |
| Priority date | — |
| Expiry date | Apr 28, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A chemical-mechanical abrasive composition for use in semiconductor processing uses abrasive particles having a non-spherical morphology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.