Mohammed K. Ghazi
3Patents
3h-index
3Co-inventors
36Inventor score
Filing activity: Feb 11, 1991 → Sep 29, 1993
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5156997A | Method of making semiconductor bonding bumps using metal cluster ion deposition | Electricity | 37 | Expired |
| US5290732A | Process for making semiconductor electrode bumps by metal cluster ion deposition and etching | Electricity | 33 | Expired |
| US5331172A | Ionized metal cluster beam systems and methods | Electricity | 19 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.