Nils D. Hoivik
14Patents
6h-index
24Co-inventors
62Inventor score
Filing activity: Dec 17, 2002 → Sep 8, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7426067B1 | Atomic layer deposition on micro-mechanical devices | Emerging Cross-Sectional Technologies | 25 | Expired |
| US7808798B2 | Versatile Si-based packaging with integrated passive components for mmWave applications | Electricity | 21 | Active |
| US7518229B2 | Versatile Si-based packaging with integrated passive components for mmWave applications | Electricity | 21 | Active |
| US7422983B2 | Ta-TaN selective removal process for integrated device fabrication | Electricity | 13 | Expired |
| US7394657B2 | Method of obtaining enhanced localized thermal interface regions by particle stacking | Electricity | 8 | Active |
| US7876565B2 | Method of obtaining enhanced localized thermal interface regions by particle stacking | Electricity | 7 | Active |
| US7192868B2 | Method of obtaining release-standing micro structures and devices by selective etch removal of protective and sacrificial layer using the same | Emerging Cross-Sectional Technologies | 5 | Expired |
| US8426316B2 | Ta-TaN selective removal process for integrated device fabrication | Electricity | 4 | Active |
| US8865597B2 | Ta—TaN selective removal process for integrated device fabrication | Electricity | 4 | Active |
| US8338920B2 | Package integrated soft magnetic film for improvement in on-chip inductor performance | Electricity | 2 | Active |
| US10308506B2 | Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices | Electricity | 1 | Active |
| US8541854B2 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | Emerging Cross-Sectional Technologies | 0 | Active |
| US11111136B2 | Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact MEMS switch devices | Electricity | 0 | Active |
| US8163584B2 | Method of minimizing beam bending of MEMS device by reducing the interfacial bonding strength between sacrificial layer and MEMS structure | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.