Versatile Si-based packaging with integrated passive components for mmWave applications

US7518229B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• John M. Cotte · New Fairfield, US
• Brian P. Gaucher · Brookfield, US
• Janusz Grzyb · Pfäffikon, CH
• Nils D. Hoivik · Pleasantville, US
• Christopher V. Jahnes · Upper Saddle River, US
• John U. Knickerbocker · Wappingers Falls, US
• Duixian Liu · Yorktown Heights, US
• John Harold Magerlein · Yorktown Heights, US
• Chirag S. Patel · Peekskill, US
• Ullrich R. Pfeiffer · Wolfsburg, DE
• Cornelia K. Tsang · Potsdam, US

Key dates

• Filing date: Aug 3, 2006
• Grant date: Apr 14, 2009
• Expiry date: Jan 25, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.