Norbert Mais
3Patents
1h-index
18Co-inventors
37Inventor score
Filing activity: Mar 2, 2012 → Jan 15, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8835319B2 | Protection layers for conductive pads and methods of formation thereof | Electricity | 2 | Active |
| US11328935B2 | Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package | Electricity | 0 | Active |
| US11127693B2 | Barrier for power metallization in semiconductor devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.