Patrick S. Spinney
6Patents
2h-index
16Co-inventors
37Inventor score
Filing activity: Sep 23, 2015 → Nov 6, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9711464B2 | Semiconductor chip with anti-reverse engineering function | Electricity | 2 | Active |
| US9553061B1 | Wiring bond pad structures | Electricity | 2 | Active |
| US10141274B2 | Semiconductor chip with anti-reverse engineering function | Electricity | 1 | Active |
| US10056306B2 | Test structure for monitoring interface delamination | Electricity | 0 | Active |
| US9893023B2 | Semiconductor chip with anti-reverse engineering function | Electricity | 0 | Active |
| US10699973B2 | Semiconductor test structure and method for forming the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.