Inventor · San Jose, CA, US

Paul Smith

24Patents
10h-index
49Co-inventors
75Inventor score

Filing activity: Apr 5, 1993 → Jan 10, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US6258223A In-situ electroless copper seed layer enhancement in an electroplating system Electricity 310 Expired
US6350320B1 Heater for processing chamber Electricity 247 Expired
US7930160B1 Electronic markup of executable models Physics 215 Active
US5671141A Computer program architecture for onboard vehicle diagnostic system Physics 93 Expired
US5983906A Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment Emerging Cross-Sectional Technologies 90 Expired
US7026238B2 Reliability barrier integration for Cu application Electricity 78 Expired
US6112697A RF powered plasma enhanced chemical vapor deposition reactor and methods Electricity 46 Expired
US6227141A RF powered plasma enhanced chemical vapor deposition reactor and methods Electricity 17 Expired
US6159867A RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition Emerging Cross-Sectional Technologies 11 Expired
US6235646A RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition Emerging Cross-Sectional Technologies 11 Expired
US7112961B2 Method and apparatus for dynamically measuring the thickness of an object Physics 8 Expired
US8336025B1 Pattern modeling methods and systems Physics 8 Active
USD918254S1 Display screen with graphical user interface General 7 Active
US6753248B1 Post metal barrier/adhesion film Electricity 5 Expired
US8525813B1 Multi-point interface for a graphical modeling environment Physics 5 Active
US8776015B1 Pattern modeling methods and systems Physics 5 Active
US7355394B2 Apparatus and method of dynamically measuring thickness of a layer of a substrate Physics 4 Active
US8519979B1 Multi-point interface for a graphical modeling environment Physics 3 Active
US7777483B2 Method and apparatus for measuring a thickness of a layer of a wafer Physics 3 Active
US6893548B2 Method of conditioning electrochemical baths in plating technology Chemistry; Metallurgy 3 Expired
US6705246B2 RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition Emerging Cross-Sectional Technologies 3 Expired
US6395128B2 RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition Emerging Cross-Sectional Technologies 2 Expired
US10705687B1 Visually indicating on a user interface lengths, types of content, structure and current user location within a corpus of electronic content Physics 1 Active
US6533894B2 RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition Emerging Cross-Sectional Technologies 1 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.