Pritha Choudhury
4Patents
1h-index
12Co-inventors
34Inventor score
Filing activity: Apr 28, 2015 → Jan 25, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10322471B2 | Low temperature high reliability alloy for solder hierarchy | Electricity | 3 | Active |
| US11411150B2 | Advanced solder alloys for electronic interconnects | Electricity | 0 | Active |
| US11090768B2 | Lead-free and antimony-free tin solder reliable at high temperatures | Performing Operations; Transporting | 0 | Active |
| US10821557B2 | High reliability lead-free solder alloy | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.