Low temperature high reliability alloy for solder hierarchy

US10322471B2 · kind B2 · utility

Assignee

• ALPHA ASSEMBLY SOLUTIONS INC. · US

Inventors

• Pritha Choudhury · Kanchinakote, IN
• Morgana de Avila Ribas · Waterbury, US
• Sutapa Mukherjee · South Plainfield, US
• Siuli Sarkar · South Plainfield, US
• Ranjit Pandher · South Plainfield, US
• Ravindra M. Bhatkal · East Brunswick Township, US
• Bawa Singh · Cherry Hill, US

Key dates

• Filing date: Jul 15, 2015
• Grant date: Jun 18, 2019
• Expiry date: Jul 15, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/01058
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.