Lead-free and antimony-free tin solder reliable at high temperatures

US11090768B2 · kind B2 · utility

Assignee

• ALPHA ASSEMBLY SOLUTIONS INC. · US

Inventors

• Pritha Choudhury · Kanchinakote, IN
• Morgana de Avila Ribas · Waterbury, US
• Sutapa Mukherjee · South Plainfield, US
• Anil Kumar · Bengaluru, IN
• Siuli Sarkar · South Plainfield, US
• Ranjit Pandher · South Plainfield, US
• Ravi Bhatkal · South Plainfield, US
• Bawa Singh · Cherry Hill, US

Key dates

• Filing date: Apr 28, 2015
• Grant date: Aug 17, 2021
• Expiry date: Jun 5, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2103/12
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.