High reliability lead-free solder alloy
US10821557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2017 |
| Grant date | Nov 3, 2020 |
| Priority date | — |
| Expiry date | Aug 2, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C13/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.