Image sensor package structure with casing including a vent without sealing and in communication with package material
US8847146B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2009 |
| Grant date | Sep 30, 2014 |
| Priority date | — |
| Expiry date | Aug 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.