Rick Kustra
4Patents
1h-index
11Co-inventors
34Inventor score
Filing activity: Aug 7, 2020 → Jun 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11721545B2 | Method of using dual frequency RF power in a process chamber | Electricity | 1 | Active |
| US11404263B2 | Deposition of low-stress carbon-containing layers | Electricity | 0 | Active |
| US11495454B2 | Deposition of low-stress boron-containing layers | Electricity | 0 | Active |
| US12106958B2 | Method of using dual frequency RF power in a process chamber | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.